Chip Packaging Market, Global Outlook and Forecast 2023-2029

Report ID: MMG49590 | Category: Electronics & Semiconductor | Pages: 102 | Format: PDF | Published Date: February 21,2023

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Report Summary

Installation of semiconductor integrated circuit chips with shell, plays a put, fixed, sealing, protection chip and enhance the effect of electrical performance, and is the communication bridge of the internal and external circuit chip, chip the contacts with wire is connected to the encapsulation of the shell on the pin of the pins and wires on the PCB and other devices connected. Therefore, encapsulation plays an important role for both CPUs and other LSI integrated circuits. Chip packaging technology has experienced several generations of changes, from DIP, QFP, PGA, BGA, to CSP and then to MCM, technical indicators generation by generation advanced, including chip area and packaging area ratio is more and more close to 1, the application frequency is more and more high, temperature performance is better and better. The number of pins is increased, the pin spacing is reduced, the weight is reduced, the reliability is improved, the use is more convenient and so on
The global chip package market reached $25,007.3 million in 2019 and is expected to reach $35,419.2 million in 2026, with a compound annual growth rate (CAGR) of 6.72%.
This report aims to provide a comprehensive presentation of the global market for Chip Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Chip Packaging. This report contains market size and forecasts of Chip Packaging in global, including the following market information:
Global Chip Packaging Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global top five companies in 2022 (%)
The global Chip Packaging market was valued at US$ 32050 million in 2022 and is projected to reach US$ 48900 million by 2029, at a CAGR of 6.2% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
By type breakdown, all markets for chip packages can be divided into the following categories:
The first category is mainly traditional packaging, which occupies a relatively large share of the global market, accounting for about 56%.
The other major category is advanced packaging, and for many companies, advanced packaging technology is very attractive, advanced packaging workers. Technology is at the heart of all semiconductor manufacturing processes today. For all semiconductor companies, advanced packaging technology is responding to the direct impact of big trends such as 5G, artificial intelligence and the Internet of Things. Advanced packaging occupies 45% of the market share.
From the regional point of view, Taiwan market output market share is larger, the market accounted for 44%, the next few years will maintain a stable growth. China and the US, with 34 per cent and 11 per cent of the output market respectively, will continue to play a significant role. Any change in China, Taiwan may affect the development trend of chip packaging.
The chip packaging market consists of a group of well-known brand manufacturers and new entrants. The leading global players in the chip packaging market are ASE Group, Amkor Technology, JCET, SPIL,Powertech Technology, Tong Fu Micro Power, Tianshui Huatian Technology, UTAC, Chipbond Technology, Hana Micron and so on. These top 10 companies now account for more than 78% of the total market share.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Chip Packaging companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Chip Packaging Market, by Type, 2018-2023, 2024-2029 ($ millions)
Global Chip Packaging Market Segment Percentages, by Type, 2022 (%)
    Traditional Packaging
    Advanced Packaging
Global Chip Packaging Market, by Application, 2018-2023, 2024-2029 ($ millions)
Global Chip Packaging Market Segment Percentages, by Application, 2022 (%)
    Automotive and Traffic
    Consumer Electronics
    Communication
    Other
Global Chip Packaging Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions)
Global Chip Packaging Market Segment Percentages, By Region and Country, 2022 (%)
    North America
        US
        Canada
        Mexico
    Europe
        Germany
        France
        U.K.
        Italy
        Russia
        Nordic Countries
        Benelux
        Rest of Europe
    Asia
        China
        Japan
        South Korea
        Southeast Asia
        India
        Rest of Asia
    South America
        Brazil
        Argentina
        Rest of South America
    Middle East & Africa
        Turkey
        Israel
        Saudi Arabia
        UAE
        Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Chip Packaging revenues in global market, 2018-2023 (estimated), ($ millions)
Key companies Chip Packaging revenues share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
    ASE Group
    Amkor Technology
    JCET
    Siliconware Precision Industries
    Powertech Technology
    TongFu Microelectronics
    Tianshui Huatian Technology
    UTAC
    Chipbond Technology
    Hana Micron
    OSE
    Walton Advanced Engineering
    NEPES
    Unisem
    ChipMOS
    Signetics
    Carsem
    King Yuan ELECTRONICS
Outline of Major Chapters:
Chapter 1: Introduces the definition of Chip Packaging, market overview.
Chapter 2: Global Chip Packaging market size in revenue.
Chapter 3: Detailed analysis of Chip Packaging company competitive landscape, revenue and market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Chip Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: The main points and conclusions of the report.

1 Introduction to Research & Analysis Reports
    1.1 Chip Packaging Market Definition
    1.2 Market Segments
        1.2.1 Market by Type
        1.2.2 Market by Application
    1.3 Global Chip Packaging Market Overview
    1.4 Features & Benefits of This Report
    1.5 Methodology & Sources of Information
        1.5.1 Research Methodology
        1.5.2 Research Process
        1.5.3 Base Year
        1.5.4 Report Assumptions & Caveats
2 Global Chip Packaging Overall Market Size
    2.1 Global Chip Packaging Market Size: 2022 VS 2029
    2.2 Global Chip Packaging Market Size, Prospects & Forecasts: 2018-2029
    2.3 Key Market Trends, Opportunity, Drivers and Restraints
        2.3.1 Market Opportunities & Trends
        2.3.2 Market Drivers
        2.3.3 Market Restraints
3 Company Landscape
    3.1 Top Chip Packaging Players in Global Market
    3.2 Top Global Chip Packaging Companies Ranked by Revenue
    3.3 Global Chip Packaging Revenue by Companies
    3.4 Top 3 and Top 5 Chip Packaging Companies in Global Market, by Revenue in 2022
    3.5 Global Companies Chip Packaging Product Type
    3.6 Tier 1, Tier 2 and Tier 3 Chip Packaging Players in Global Market
        3.6.1 List of Global Tier 1 Chip Packaging Companies
        3.6.2 List of Global Tier 2 and Tier 3 Chip Packaging Companies
4 Market Sights by Product
    4.1 Overview
        4.1.1 By Type - Global Chip Packaging Market Size Markets, 2022 & 2029
        4.1.2 Traditional Packaging
        4.1.3 Advanced Packaging
    4.2 By Type - Global Chip Packaging Revenue & Forecasts
        4.2.1 By Type - Global Chip Packaging Revenue, 2018-2023
        4.2.2 By Type - Global Chip Packaging Revenue, 2024-2029
        4.2.3 By Type - Global Chip Packaging Revenue Market Share, 2018-2029
5 Sights by Application
    5.1 Overview
        5.1.1 By Application - Global Chip Packaging Market Size, 2022 & 2029
        5.1.2 Automotive and Traffic
        5.1.3 Consumer Electronics
        5.1.4 Communication
        5.1.5 Other
    5.2 By Application - Global Chip Packaging Revenue & Forecasts
        5.2.1 By Application - Global Chip Packaging Revenue, 2018-2023
        5.2.2 By Application - Global Chip Packaging Revenue, 2024-2029
        5.2.3 By Application - Global Chip Packaging Revenue Market Share, 2018-2029
6 Sights by Region
    6.1 By Region - Global Chip Packaging Market Size, 2022 & 2029
    6.2 By Region - Global Chip Packaging Revenue & Forecasts
        6.2.1 By Region - Global Chip Packaging Revenue, 2018-2023
        6.2.2 By Region - Global Chip Packaging Revenue, 2024-2029
        6.2.3 By Region - Global Chip Packaging Revenue Market Share, 2018-2029
    6.3 North America
        6.3.1 By Country - North America Chip Packaging Revenue, 2018-2029
        6.3.2 US Chip Packaging Market Size, 2018-2029
        6.3.3 Canada Chip Packaging Market Size, 2018-2029
        6.3.4 Mexico Chip Packaging Market Size, 2018-2029
    6.4 Europe
        6.4.1 By Country - Europe Chip Packaging Revenue, 2018-2029
        6.4.2 Germany Chip Packaging Market Size, 2018-2029
        6.4.3 France Chip Packaging Market Size, 2018-2029
        6.4.4 U.K. Chip Packaging Market Size, 2018-2029
        6.4.5 Italy Chip Packaging Market Size, 2018-2029
        6.4.6 Russia Chip Packaging Market Size, 2018-2029
        6.4.7 Nordic Countries Chip Packaging Market Size, 2018-2029
        6.4.8 Benelux Chip Packaging Market Size, 2018-2029
    6.5 Asia
        6.5.1 By Region - Asia Chip Packaging Revenue, 2018-2029
        6.5.2 China Chip Packaging Market Size, 2018-2029
        6.5.3 Japan Chip Packaging Market Size, 2018-2029
        6.5.4 South Korea Chip Packaging Market Size, 2018-2029
        6.5.5 Southeast Asia Chip Packaging Market Size, 2018-2029
        6.5.6 India Chip Packaging Market Size, 2018-2029
    6.6 South America
        6.6.1 By Country - South America Chip Packaging Revenue, 2018-2029
        6.6.2 Brazil Chip Packaging Market Size, 2018-2029
        6.6.3 Argentina Chip Packaging Market Size, 2018-2029
    6.7 Middle East & Africa
        6.7.1 By Country - Middle East & Africa Chip Packaging Revenue, 2018-2029
        6.7.2 Turkey Chip Packaging Market Size, 2018-2029
        6.7.3 Israel Chip Packaging Market Size, 2018-2029
        6.7.4 Saudi Arabia Chip Packaging Market Size, 2018-2029
        6.7.5 UAE Chip Packaging Market Size, 2018-2029
7 Chip Packaging Companies Profiles
    7.1 ASE Group
        7.1.1 ASE Group Company Summary
        7.1.2 ASE Group Business Overview
        7.1.3 ASE Group Chip Packaging Major Product Offerings
        7.1.4 ASE Group Chip Packaging Revenue in Global Market (2018-2023)
        7.1.5 ASE Group Key News & Latest Developments
    7.2 Amkor Technology
        7.2.1 Amkor Technology Company Summary
        7.2.2 Amkor Technology Business Overview
        7.2.3 Amkor Technology Chip Packaging Major Product Offerings
        7.2.4 Amkor Technology Chip Packaging Revenue in Global Market (2018-2023)
        7.2.5 Amkor Technology Key News & Latest Developments
    7.3 JCET
        7.3.1 JCET Company Summary
        7.3.2 JCET Business Overview
        7.3.3 JCET Chip Packaging Major Product Offerings
        7.3.4 JCET Chip Packaging Revenue in Global Market (2018-2023)
        7.3.5 JCET Key News & Latest Developments
    7.4 Siliconware Precision Industries
        7.4.1 Siliconware Precision Industries Company Summary
        7.4.2 Siliconware Precision Industries Business Overview
        7.4.3 Siliconware Precision Industries Chip Packaging Major Product Offerings
        7.4.4 Siliconware Precision Industries Chip Packaging Revenue in Global Market (2018-2023)
        7.4.5 Siliconware Precision Industries Key News & Latest Developments
    7.5 Powertech Technology
        7.5.1 Powertech Technology Company Summary
        7.5.2 Powertech Technology Business Overview
        7.5.3 Powertech Technology Chip Packaging Major Product Offerings
        7.5.4 Powertech Technology Chip Packaging Revenue in Global Market (2018-2023)
        7.5.5 Powertech Technology Key News & Latest Developments
    7.6 TongFu Microelectronics
        7.6.1 TongFu Microelectronics Company Summary
        7.6.2 TongFu Microelectronics Business Overview
        7.6.3 TongFu Microelectronics Chip Packaging Major Product Offerings
        7.6.4 TongFu Microelectronics Chip Packaging Revenue in Global Market (2018-2023)
        7.6.5 TongFu Microelectronics Key News & Latest Developments
    7.7 Tianshui Huatian Technology
        7.7.1 Tianshui Huatian Technology Company Summary
        7.7.2 Tianshui Huatian Technology Business Overview
        7.7.3 Tianshui Huatian Technology Chip Packaging Major Product Offerings
        7.7.4 Tianshui Huatian Technology Chip Packaging Revenue in Global Market (2018-2023)
        7.7.5 Tianshui Huatian Technology Key News & Latest Developments
    7.8 UTAC
        7.8.1 UTAC Company Summary
        7.8.2 UTAC Business Overview
        7.8.3 UTAC Chip Packaging Major Product Offerings
        7.8.4 UTAC Chip Packaging Revenue in Global Market (2018-2023)
        7.8.5 UTAC Key News & Latest Developments
    7.9 Chipbond Technology
        7.9.1 Chipbond Technology Company Summary
        7.9.2 Chipbond Technology Business Overview
        7.9.3 Chipbond Technology Chip Packaging Major Product Offerings
        7.9.4 Chipbond Technology Chip Packaging Revenue in Global Market (2018-2023)
        7.9.5 Chipbond Technology Key News & Latest Developments
    7.10 Hana Micron
        7.10.1 Hana Micron Company Summary
        7.10.2 Hana Micron Business Overview
        7.10.3 Hana Micron Chip Packaging Major Product Offerings
        7.10.4 Hana Micron Chip Packaging Revenue in Global Market (2018-2023)
        7.10.5 Hana Micron Key News & Latest Developments
    7.11 OSE
        7.11.1 OSE Company Summary
        7.11.2 OSE Business Overview
        7.11.3 OSE Chip Packaging Major Product Offerings
        7.11.4 OSE Chip Packaging Revenue in Global Market (2018-2023)
        7.11.5 OSE Key News & Latest Developments
    7.12 Walton Advanced Engineering
        7.12.1 Walton Advanced Engineering Company Summary
        7.12.2 Walton Advanced Engineering Business Overview
        7.12.3 Walton Advanced Engineering Chip Packaging Major Product Offerings
        7.12.4 Walton Advanced Engineering Chip Packaging Revenue in Global Market (2018-2023)
        7.12.5 Walton Advanced Engineering Key News & Latest Developments
    7.13 NEPES
        7.13.1 NEPES Company Summary
        7.13.2 NEPES Business Overview
        7.13.3 NEPES Chip Packaging Major Product Offerings
        7.13.4 NEPES Chip Packaging Revenue in Global Market (2018-2023)
        7.13.5 NEPES Key News & Latest Developments
    7.14 Unisem
        7.14.1 Unisem Company Summary
        7.14.2 Unisem Business Overview
        7.14.3 Unisem Chip Packaging Major Product Offerings
        7.14.4 Unisem Chip Packaging Revenue in Global Market (2018-2023)
        7.14.5 Unisem Key News & Latest Developments
    7.15 ChipMOS
        7.15.1 ChipMOS Company Summary
        7.15.2 ChipMOS Business Overview
        7.15.3 ChipMOS Chip Packaging Major Product Offerings
        7.15.4 ChipMOS Chip Packaging Revenue in Global Market (2018-2023)
        7.15.5 ChipMOS Key News & Latest Developments
    7.16 Signetics
        7.16.1 Signetics Company Summary
        7.16.2 Signetics Business Overview
        7.16.3 Signetics Chip Packaging Major Product Offerings
        7.16.4 Signetics Chip Packaging Revenue in Global Market (2018-2023)
        7.16.5 Signetics Key News & Latest Developments
    7.17 Carsem
        7.17.1 Carsem Company Summary
        7.17.2 Carsem Business Overview
        7.17.3 Carsem Chip Packaging Major Product Offerings
        7.17.4 Carsem Chip Packaging Revenue in Global Market (2018-2023)
        7.17.5 Carsem Key News & Latest Developments
    7.18 King Yuan ELECTRONICS
        7.18.1 King Yuan ELECTRONICS Company Summary
        7.18.2 King Yuan ELECTRONICS Business Overview
        7.18.3 King Yuan ELECTRONICS Chip Packaging Major Product Offerings
        7.18.4 King Yuan ELECTRONICS Chip Packaging Revenue in Global Market (2018-2023)
        7.18.5 King Yuan ELECTRONICS Key News & Latest Developments
8 Conclusion
9 Appendix
    9.1 Note
    9.2 Examples of Clients
    9.3 Disclaimer

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Chip Packaging Market, Global Outlook and Forecast 2023-2029

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