Global Thermal Copper Pillar Bump Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029

Report ID: GIR2302110019 | Category: Electronics & Semiconductor | Pages: 118 | Format: PDF | Published Date: February 27,2023

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Report Summary

According to our (Global Info Research) latest study, the global Thermal Copper Pillar Bump market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The Thermal Copper Pillar Bump, also known as the thermal bump or TCPB, is a thermoelectric device made from thin-film thermoelectric material embedded in flip chip interconnects (in particular Copper Pillar Bumps) for use in electronics and optoelectronic packaging, including flip chip packaging of CPU and GPU integrated circuits (chips), laser diodes, and semi-conductor optical amplifiers (SOA). Unlike conventional solder bumps that provide an electrical path and a mechanical structure for connection to the package, thermal bumps act as solid-state heat pumps and add thermal management functionality on the surface of a chip or other electrical component...
This report is a detailed and comprehensive analysis for global Thermal Copper Pillar Bump market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2023, are provided.
Key Features:
Global Thermal Copper Pillar Bump market size and forecasts, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2018-2029
Global Thermal Copper Pillar Bump market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2018-2029
Global Thermal Copper Pillar Bump market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2018-2029
Global Thermal Copper Pillar Bump market shares of main players, shipments in revenue ($ Million), sales quantity (K Units), and ASP (US$/Unit), 2018-2023
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Thermal Copper Pillar Bump
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Thermal Copper Pillar Bump market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Intel, Samsung, LB Semicon Inc, DuPont and FINECS, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.
Market Segmentation
Thermal Copper Pillar Bump market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
    Standard Cu Pillar
    Fine Pitch Cu Pillar
    Micro-Bumps
    Others
Market segment by Application
    Consumer Electronics
    Automobile
    Industrial Equipment
    Medical Insurance
    Military and Defense
    Aeronautics and Astronautics
    Telecom
Major players covered
    Intel
    Samsung
    LB Semicon Inc
    DuPont
    FINECS
    Amkor Technology
    SHINKO ELECTRIC INDUSTRIES CO.,LTD.
    ASE
    Raytek Semiconductor,Inc.
    Sigurd Microelectronics Corporation
    Nepes
    SJ Group Co Ltd
    ChipMOS TECHNOLOGIES
    Element Solutions
    Jiangsu Changjiang Electronics Tech Co
Market segment by region, regional analysis covers
    North America (United States, Canada and Mexico)
    Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
    Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
    South America (Brazil, Argentina, Colombia, and Rest of South America)
    Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Thermal Copper Pillar Bump product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Thermal Copper Pillar Bump, with price, sales, revenue and global market share of Thermal Copper Pillar Bump from 2018 to 2023.
Chapter 3, the Thermal Copper Pillar Bump competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Thermal Copper Pillar Bump breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2018 to 2029.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2018 to 2029.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2022.and Thermal Copper Pillar Bump market forecast, by regions, type and application, with sales and revenue, from 2024 to 2029.
Chapter 12, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War.
Chapter 13, the key raw materials and key suppliers, and industry chain of Thermal Copper Pillar Bump.
Chapter 14 and 15, to describe Thermal Copper Pillar Bump sales channel, distributors, customers, research findings and conclusion.

1 Market Overview
    1.1 Product Overview and Scope of Thermal Copper Pillar Bump
    1.2 Market Estimation Caveats and Base Year
    1.3 Market Analysis by Type
        1.3.1 Overview: Global Thermal Copper Pillar Bump Consumption Value by Type: 2018 Versus 2022 Versus 2029
        1.3.2 Standard Cu Pillar
        1.3.3 Fine Pitch Cu Pillar
        1.3.4 Micro-Bumps
        1.3.5 Others
    1.4 Market Analysis by Application
        1.4.1 Overview: Global Thermal Copper Pillar Bump Consumption Value by Application: 2018 Versus 2022 Versus 2029
        1.4.2 Consumer Electronics
        1.4.3 Automobile
        1.4.4 Industrial Equipment
        1.4.5 Medical Insurance
        1.4.6 Military and Defense
        1.4.7 Aeronautics and Astronautics
        1.4.8 Telecom
    1.5 Global Thermal Copper Pillar Bump Market Size & Forecast
        1.5.1 Global Thermal Copper Pillar Bump Consumption Value (2018 & 2022 & 2029)
        1.5.2 Global Thermal Copper Pillar Bump Sales Quantity (2018-2029)
        1.5.3 Global Thermal Copper Pillar Bump Average Price (2018-2029) 
2 Manufacturers Profiles
    2.1 Intel
        2.1.1 Intel Details
        2.1.2 Intel Major Business
        2.1.3 Intel Thermal Copper Pillar Bump Product and Services
        2.1.4 Intel Thermal Copper Pillar Bump Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.1.5 Intel Recent Developments/Updates
    2.2 Samsung
        2.2.1 Samsung Details
        2.2.2 Samsung Major Business
        2.2.3 Samsung Thermal Copper Pillar Bump Product and Services
        2.2.4 Samsung Thermal Copper Pillar Bump Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.2.5 Samsung Recent Developments/Updates
    2.3 LB Semicon Inc
        2.3.1 LB Semicon Inc Details
        2.3.2 LB Semicon Inc Major Business
        2.3.3 LB Semicon Inc Thermal Copper Pillar Bump Product and Services
        2.3.4 LB Semicon Inc Thermal Copper Pillar Bump Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.3.5 LB Semicon Inc Recent Developments/Updates
    2.4 DuPont
        2.4.1 DuPont Details
        2.4.2 DuPont Major Business
        2.4.3 DuPont Thermal Copper Pillar Bump Product and Services
        2.4.4 DuPont Thermal Copper Pillar Bump Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.4.5 DuPont Recent Developments/Updates
    2.5 FINECS
        2.5.1 FINECS Details
        2.5.2 FINECS Major Business
        2.5.3 FINECS Thermal Copper Pillar Bump Product and Services
        2.5.4 FINECS Thermal Copper Pillar Bump Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.5.5 FINECS Recent Developments/Updates
    2.6 Amkor Technology
        2.6.1 Amkor Technology Details
        2.6.2 Amkor Technology Major Business
        2.6.3 Amkor Technology Thermal Copper Pillar Bump Product and Services
        2.6.4 Amkor Technology Thermal Copper Pillar Bump Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.6.5 Amkor Technology Recent Developments/Updates
    2.7 SHINKO ELECTRIC INDUSTRIES CO.,LTD.
        2.7.1 SHINKO ELECTRIC INDUSTRIES CO.,LTD. Details
        2.7.2 SHINKO ELECTRIC INDUSTRIES CO.,LTD. Major Business
        2.7.3 SHINKO ELECTRIC INDUSTRIES CO.,LTD. Thermal Copper Pillar Bump Product and Services
        2.7.4 SHINKO ELECTRIC INDUSTRIES CO.,LTD. Thermal Copper Pillar Bump Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.7.5 SHINKO ELECTRIC INDUSTRIES CO.,LTD. Recent Developments/Updates
    2.8 ASE
        2.8.1 ASE Details
        2.8.2 ASE Major Business
        2.8.3 ASE Thermal Copper Pillar Bump Product and Services
        2.8.4 ASE Thermal Copper Pillar Bump Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.8.5 ASE Recent Developments/Updates
    2.9 Raytek Semiconductor,Inc.
        2.9.1 Raytek Semiconductor,Inc. Details
        2.9.2 Raytek Semiconductor,Inc. Major Business
        2.9.3 Raytek Semiconductor,Inc. Thermal Copper Pillar Bump Product and Services
        2.9.4 Raytek Semiconductor,Inc. Thermal Copper Pillar Bump Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.9.5 Raytek Semiconductor,Inc. Recent Developments/Updates
    2.10 Sigurd Microelectronics Corporation
        2.10.1 Sigurd Microelectronics Corporation Details
        2.10.2 Sigurd Microelectronics Corporation Major Business
        2.10.3 Sigurd Microelectronics Corporation Thermal Copper Pillar Bump Product and Services
        2.10.4 Sigurd Microelectronics Corporation Thermal Copper Pillar Bump Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.10.5 Sigurd Microelectronics Corporation Recent Developments/Updates
    2.11 Nepes
        2.11.1 Nepes Details
        2.11.2 Nepes Major Business
        2.11.3 Nepes Thermal Copper Pillar Bump Product and Services
        2.11.4 Nepes Thermal Copper Pillar Bump Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.11.5 Nepes Recent Developments/Updates
    2.12 SJ Group Co Ltd
        2.12.1 SJ Group Co Ltd Details
        2.12.2 SJ Group Co Ltd Major Business
        2.12.3 SJ Group Co Ltd Thermal Copper Pillar Bump Product and Services
        2.12.4 SJ Group Co Ltd Thermal Copper Pillar Bump Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.12.5 SJ Group Co Ltd Recent Developments/Updates
    2.13 ChipMOS TECHNOLOGIES
        2.13.1 ChipMOS TECHNOLOGIES Details
        2.13.2 ChipMOS TECHNOLOGIES Major Business
        2.13.3 ChipMOS TECHNOLOGIES Thermal Copper Pillar Bump Product and Services
        2.13.4 ChipMOS TECHNOLOGIES Thermal Copper Pillar Bump Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.13.5 ChipMOS TECHNOLOGIES Recent Developments/Updates
    2.14 Element Solutions
        2.14.1 Element Solutions Details
        2.14.2 Element Solutions Major Business
        2.14.3 Element Solutions Thermal Copper Pillar Bump Product and Services
        2.14.4 Element Solutions Thermal Copper Pillar Bump Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.14.5 Element Solutions Recent Developments/Updates
    2.15 Jiangsu Changjiang Electronics Tech Co
        2.15.1 Jiangsu Changjiang Electronics Tech Co Details
        2.15.2 Jiangsu Changjiang Electronics Tech Co Major Business
        2.15.3 Jiangsu Changjiang Electronics Tech Co Thermal Copper Pillar Bump Product and Services
        2.15.4 Jiangsu Changjiang Electronics Tech Co Thermal Copper Pillar Bump Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
        2.15.5 Jiangsu Changjiang Electronics Tech Co Recent Developments/Updates
3 Competitive Environment: Thermal Copper Pillar Bump by Manufacturer
    3.1 Global Thermal Copper Pillar Bump Sales Quantity by Manufacturer (2018-2023)
    3.2 Global Thermal Copper Pillar Bump Revenue by Manufacturer (2018-2023)
    3.3 Global Thermal Copper Pillar Bump Average Price by Manufacturer (2018-2023)
    3.4 Market Share Analysis (2022)
        3.4.1 Producer Shipments of Thermal Copper Pillar Bump by Manufacturer Revenue ($MM) and Market Share (%): 2022
        3.4.2 Top 3 Thermal Copper Pillar Bump Manufacturer Market Share in 2022
        3.4.2 Top 6 Thermal Copper Pillar Bump Manufacturer Market Share in 2022
    3.5 Thermal Copper Pillar Bump Market: Overall Company Footprint Analysis
        3.5.1 Thermal Copper Pillar Bump Market: Region Footprint
        3.5.2 Thermal Copper Pillar Bump Market: Company Product Type Footprint
        3.5.3 Thermal Copper Pillar Bump Market: Company Product Application Footprint
    3.6 New Market Entrants and Barriers to Market Entry
    3.7 Mergers, Acquisition, Agreements, and Collaborations
4 Consumption Analysis by Region
    4.1 Global Thermal Copper Pillar Bump Market Size by Region
        4.1.1 Global Thermal Copper Pillar Bump Sales Quantity by Region (2018-2029)
        4.1.2 Global Thermal Copper Pillar Bump Consumption Value by Region (2018-2029)
        4.1.3 Global Thermal Copper Pillar Bump Average Price by Region (2018-2029)
    4.2 North America Thermal Copper Pillar Bump Consumption Value (2018-2029)
    4.3 Europe Thermal Copper Pillar Bump Consumption Value (2018-2029)
    4.4 Asia-Pacific Thermal Copper Pillar Bump Consumption Value (2018-2029)
    4.5 South America Thermal Copper Pillar Bump Consumption Value (2018-2029)
    4.6 Middle East and Africa Thermal Copper Pillar Bump Consumption Value (2018-2029)
5 Market Segment by Type
    5.1 Global Thermal Copper Pillar Bump Sales Quantity by Type (2018-2029)
    5.2 Global Thermal Copper Pillar Bump Consumption Value by Type (2018-2029)
    5.3 Global Thermal Copper Pillar Bump Average Price by Type (2018-2029)
6 Market Segment by Application
    6.1 Global Thermal Copper Pillar Bump Sales Quantity by Application (2018-2029)
    6.2 Global Thermal Copper Pillar Bump Consumption Value by Application (2018-2029)
    6.3 Global Thermal Copper Pillar Bump Average Price by Application (2018-2029)
7 North America
    7.1 North America Thermal Copper Pillar Bump Sales Quantity by Type (2018-2029)
    7.2 North America Thermal Copper Pillar Bump Sales Quantity by Application (2018-2029)
    7.3 North America Thermal Copper Pillar Bump Market Size by Country
        7.3.1 North America Thermal Copper Pillar Bump Sales Quantity by Country (2018-2029)
        7.3.2 North America Thermal Copper Pillar Bump Consumption Value by Country (2018-2029)
        7.3.3 United States Market Size and Forecast (2018-2029)
        7.3.4 Canada Market Size and Forecast (2018-2029)
        7.3.5 Mexico Market Size and Forecast (2018-2029)
8 Europe
    8.1 Europe Thermal Copper Pillar Bump Sales Quantity by Type (2018-2029)
    8.2 Europe Thermal Copper Pillar Bump Sales Quantity by Application (2018-2029)
    8.3 Europe Thermal Copper Pillar Bump Market Size by Country
        8.3.1 Europe Thermal Copper Pillar Bump Sales Quantity by Country (2018-2029)
        8.3.2 Europe Thermal Copper Pillar Bump Consumption Value by Country (2018-2029)
        8.3.3 Germany Market Size and Forecast (2018-2029)
        8.3.4 France Market Size and Forecast (2018-2029)
        8.3.5 United Kingdom Market Size and Forecast (2018-2029)
        8.3.6 Russia Market Size and Forecast (2018-2029)
        8.3.7 Italy Market Size and Forecast (2018-2029)
9 Asia-Pacific
    9.1 Asia-Pacific Thermal Copper Pillar Bump Sales Quantity by Type (2018-2029)
    9.2 Asia-Pacific Thermal Copper Pillar Bump Sales Quantity by Application (2018-2029)
    9.3 Asia-Pacific Thermal Copper Pillar Bump Market Size by Region
        9.3.1 Asia-Pacific Thermal Copper Pillar Bump Sales Quantity by Region (2018-2029)
        9.3.2 Asia-Pacific Thermal Copper Pillar Bump Consumption Value by Region (2018-2029)
        9.3.3 China Market Size and Forecast (2018-2029)
        9.3.4 Japan Market Size and Forecast (2018-2029)
        9.3.5 Korea Market Size and Forecast (2018-2029)
        9.3.6 India Market Size and Forecast (2018-2029)
        9.3.7 Southeast Asia Market Size and Forecast (2018-2029)
        9.3.8 Australia Market Size and Forecast (2018-2029)
10 South America
    10.1 South America Thermal Copper Pillar Bump Sales Quantity by Type (2018-2029)
    10.2 South America Thermal Copper Pillar Bump Sales Quantity by Application (2018-2029)
    10.3 South America Thermal Copper Pillar Bump Market Size by Country
        10.3.1 South America Thermal Copper Pillar Bump Sales Quantity by Country (2018-2029)
        10.3.2 South America Thermal Copper Pillar Bump Consumption Value by Country (2018-2029)
        10.3.3 Brazil Market Size and Forecast (2018-2029)
        10.3.4 Argentina Market Size and Forecast (2018-2029)
11 Middle East & Africa
    11.1 Middle East & Africa Thermal Copper Pillar Bump Sales Quantity by Type (2018-2029)
    11.2 Middle East & Africa Thermal Copper Pillar Bump Sales Quantity by Application (2018-2029)
    11.3 Middle East & Africa Thermal Copper Pillar Bump Market Size by Country
        11.3.1 Middle East & Africa Thermal Copper Pillar Bump Sales Quantity by Country (2018-2029)
        11.3.2 Middle East & Africa Thermal Copper Pillar Bump Consumption Value by Country (2018-2029)
        11.3.3 Turkey Market Size and Forecast (2018-2029)
        11.3.4 Egypt Market Size and Forecast (2018-2029)
        11.3.5 Saudi Arabia Market Size and Forecast (2018-2029)
        11.3.6 South Africa Market Size and Forecast (2018-2029)
12 Market Dynamics
    12.1 Thermal Copper Pillar Bump Market Drivers
    12.2 Thermal Copper Pillar Bump Market Restraints
    12.3 Thermal Copper Pillar Bump Trends Analysis
    12.4 Porters Five Forces Analysis
        12.4.1 Threat of New Entrants
        12.4.2 Bargaining Power of Suppliers
        12.4.3 Bargaining Power of Buyers
        12.4.4 Threat of Substitutes
        12.4.5 Competitive Rivalry
    12.5 Influence of COVID-19 and Russia-Ukraine War
        12.5.1 Influence of COVID-19
        12.5.2 Influence of Russia-Ukraine War
13 Raw Material and Industry Chain
    13.1 Raw Material of Thermal Copper Pillar Bump and Key Manufacturers
    13.2 Manufacturing Costs Percentage of Thermal Copper Pillar Bump
    13.3 Thermal Copper Pillar Bump Production Process
    13.4 Thermal Copper Pillar Bump Industrial Chain
14 Shipments by Distribution Channel
    14.1 Sales Channel
        14.1.1 Direct to End-User
        14.1.2 Distributors
    14.2 Thermal Copper Pillar Bump Typical Distributors
    14.3 Thermal Copper Pillar Bump Typical Customers
15 Research Findings and Conclusion
16 Appendix
    16.1 Methodology
    16.2 Research Process and Data Source
    16.3 Disclaimer

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Global Thermal Copper Pillar Bump Market 2023 by Manufacturers, Regions, Type and Application, Forecast to 2029

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