Precision Wafer Dicing Blade Market, Global Outlook and Forecast 2023-2029

Report ID: MMG300652 | Category: Electronics & Semiconductor | Pages: 76 | Format: PDF | Published Date: December 08,2023

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Report Summary

The global Precision Wafer Dicing Blade market was valued at US$ 285 million in 2022 and is projected to reach US$ 443.1 million by 2029, at a CAGR of 6.5% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million.
Metal Wafer Dicing Blade Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of Precision Wafer Dicing Blade include DISCO Corporation, Thermocarbon Inc., Kulicke and Soffa, ADT, Shanghai Sinyang Semiconductor Materials, Shenzhen West Technology Co., Ltd., UKAM, Ceiba and Shanghai Xiyue Machinery Technology Co., Ltd., etc. in 2022, the global top five players have a share approximately % in terms of revenue.
This report aims to provide a comprehensive presentation of the global market for Precision Wafer Dicing Blade, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Precision Wafer Dicing Blade. This report contains market size and forecasts of Precision Wafer Dicing Blade in global, including the following market information:
Global Precision Wafer Dicing Blade Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Precision Wafer Dicing Blade Market Sales, 2018-2023, 2024-2029, (K Units)
Global top five Precision Wafer Dicing Blade companies in 2022 (%)
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Precision Wafer Dicing Blade manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Precision Wafer Dicing Blade Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Precision Wafer Dicing Blade Market Segment Percentages, by Type, 2022 (%)
    Metal Wafer Dicing Blade
    Resin Wafer Dicing Blade
    Electroplated Wafer Dicing Blade
Global Precision Wafer Dicing Blade Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Precision Wafer Dicing Blade Market Segment Percentages, by Application, 2022 (%)
    IC
    Discrete Devices
    Others
Global Precision Wafer Dicing Blade Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Precision Wafer Dicing Blade Market Segment Percentages, By Region and Country, 2022 (%)
    North America
        US
        Canada
        Mexico
    Europe
        Germany
        France
        U.K.
        Italy
        Russia
        Nordic Countries
        Benelux
        Rest of Europe
    Asia
        China
        Japan
        South Korea
        Southeast Asia
        India
        Rest of Asia
    South America
        Brazil
        Argentina
        Rest of South America
    Middle East & Africa
        Turkey
        Israel
        Saudi Arabia
        UAE
        Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Precision Wafer Dicing Blade revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Precision Wafer Dicing Blade revenues share in global market, 2022 (%)
Key companies Precision Wafer Dicing Blade sales in global market, 2018-2023 (Estimated), (K Units)
Key companies Precision Wafer Dicing Blade sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
    DISCO Corporation
    Thermocarbon Inc.
    Kulicke and Soffa
    ADT
    Shanghai Sinyang Semiconductor Materials
    Shenzhen West Technology Co., Ltd.
    UKAM
    Ceiba
    Shanghai Xiyue Machinery Technology Co., Ltd.
    Zhengzhou Qisheng Precision Manufacturing Co., Ltd.
Outline of Major Chapters:
Chapter 1: Introduces the definition of Precision Wafer Dicing Blade, market overview.
Chapter 2: Global Precision Wafer Dicing Blade market size in revenue and volume.
Chapter 3: Detailed analysis of Precision Wafer Dicing Blade manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Precision Wafer Dicing Blade in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Precision Wafer Dicing Blade capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.

1 Introduction to Research & Analysis Reports
    1.1 Precision Wafer Dicing Blade Market Definition
    1.2 Market Segments
        1.2.1 Market by Type
        1.2.2 Market by Application
    1.3 Global Precision Wafer Dicing Blade Market Overview
    1.4 Features & Benefits of This Report
    1.5 Methodology & Sources of Information
        1.5.1 Research Methodology
        1.5.2 Research Process
        1.5.3 Base Year
        1.5.4 Report Assumptions & Caveats
2 Global Precision Wafer Dicing Blade Overall Market Size
    2.1 Global Precision Wafer Dicing Blade Market Size: 2022 VS 2029
    2.2 Global Precision Wafer Dicing Blade Revenue, Prospects & Forecasts: 2018-2029
    2.3 Global Precision Wafer Dicing Blade Sales: 2018-2029
3 Company Landscape
    3.1 Top Precision Wafer Dicing Blade Players in Global Market
    3.2 Top Global Precision Wafer Dicing Blade Companies Ranked by Revenue
    3.3 Global Precision Wafer Dicing Blade Revenue by Companies
    3.4 Global Precision Wafer Dicing Blade Sales by Companies
    3.5 Global Precision Wafer Dicing Blade Price by Manufacturer (2018-2023)
    3.6 Top 3 and Top 5 Precision Wafer Dicing Blade Companies in Global Market, by Revenue in 2022
    3.7 Global Manufacturers Precision Wafer Dicing Blade Product Type
    3.8 Tier 1, Tier 2 and Tier 3 Precision Wafer Dicing Blade Players in Global Market
        3.8.1 List of Global Tier 1 Precision Wafer Dicing Blade Companies
        3.8.2 List of Global Tier 2 and Tier 3 Precision Wafer Dicing Blade Companies
4 Sights by Product
    4.1 Overview
        4.1.1 By Type - Global Precision Wafer Dicing Blade Market Size Markets, 2022 & 2029
        4.1.2 Metal Wafer Dicing Blade
        4.1.3 Resin Wafer Dicing Blade
        4.1.4 Electroplated Wafer Dicing Blade
    4.2 By Type - Global Precision Wafer Dicing Blade Revenue & Forecasts
        4.2.1 By Type - Global Precision Wafer Dicing Blade Revenue, 2018-2023
        4.2.2 By Type - Global Precision Wafer Dicing Blade Revenue, 2024-2029
        4.2.3 By Type - Global Precision Wafer Dicing Blade Revenue Market Share, 2018-2029
    4.3 By Type - Global Precision Wafer Dicing Blade Sales & Forecasts
        4.3.1 By Type - Global Precision Wafer Dicing Blade Sales, 2018-2023
        4.3.2 By Type - Global Precision Wafer Dicing Blade Sales, 2024-2029
        4.3.3 By Type - Global Precision Wafer Dicing Blade Sales Market Share, 2018-2029
    4.4 By Type - Global Precision Wafer Dicing Blade Price (Manufacturers Selling Prices), 2018-2029
5 Sights by Application
    5.1 Overview
        5.1.1 By Application - Global Precision Wafer Dicing Blade Market Size, 2022 & 2029
        5.1.2 IC
        5.1.3 Discrete Devices
        5.1.4 Others
    5.2 By Application - Global Precision Wafer Dicing Blade Revenue & Forecasts
        5.2.1 By Application - Global Precision Wafer Dicing Blade Revenue, 2018-2023
        5.2.2 By Application - Global Precision Wafer Dicing Blade Revenue, 2024-2029
        5.2.3 By Application - Global Precision Wafer Dicing Blade Revenue Market Share, 2018-2029
    5.3 By Application - Global Precision Wafer Dicing Blade Sales & Forecasts
        5.3.1 By Application - Global Precision Wafer Dicing Blade Sales, 2018-2023
        5.3.2 By Application - Global Precision Wafer Dicing Blade Sales, 2024-2029
        5.3.3 By Application - Global Precision Wafer Dicing Blade Sales Market Share, 2018-2029
    5.4 By Application - Global Precision Wafer Dicing Blade Price (Manufacturers Selling Prices), 2018-2029
6 Sights by Region
    6.1 By Region - Global Precision Wafer Dicing Blade Market Size, 2022 & 2029
    6.2 By Region - Global Precision Wafer Dicing Blade Revenue & Forecasts
        6.2.1 By Region - Global Precision Wafer Dicing Blade Revenue, 2018-2023
        6.2.2 By Region - Global Precision Wafer Dicing Blade Revenue, 2024-2029
        6.2.3 By Region - Global Precision Wafer Dicing Blade Revenue Market Share, 2018-2029
    6.3 By Region - Global Precision Wafer Dicing Blade Sales & Forecasts
        6.3.1 By Region - Global Precision Wafer Dicing Blade Sales, 2018-2023
        6.3.2 By Region - Global Precision Wafer Dicing Blade Sales, 2024-2029
        6.3.3 By Region - Global Precision Wafer Dicing Blade Sales Market Share, 2018-2029
    6.4 North America
        6.4.1 By Country - North America Precision Wafer Dicing Blade Revenue, 2018-2029
        6.4.2 By Country - North America Precision Wafer Dicing Blade Sales, 2018-2029
        6.4.3 US Precision Wafer Dicing Blade Market Size, 2018-2029
        6.4.4 Canada Precision Wafer Dicing Blade Market Size, 2018-2029
        6.4.5 Mexico Precision Wafer Dicing Blade Market Size, 2018-2029
    6.5 Europe
        6.5.1 By Country - Europe Precision Wafer Dicing Blade Revenue, 2018-2029
        6.5.2 By Country - Europe Precision Wafer Dicing Blade Sales, 2018-2029
        6.5.3 Germany Precision Wafer Dicing Blade Market Size, 2018-2029
        6.5.4 France Precision Wafer Dicing Blade Market Size, 2018-2029
        6.5.5 U.K. Precision Wafer Dicing Blade Market Size, 2018-2029
        6.5.6 Italy Precision Wafer Dicing Blade Market Size, 2018-2029
        6.5.7 Russia Precision Wafer Dicing Blade Market Size, 2018-2029
        6.5.8 Nordic Countries Precision Wafer Dicing Blade Market Size, 2018-2029
        6.5.9 Benelux Precision Wafer Dicing Blade Market Size, 2018-2029
    6.6 Asia
        6.6.1 By Region - Asia Precision Wafer Dicing Blade Revenue, 2018-2029
        6.6.2 By Region - Asia Precision Wafer Dicing Blade Sales, 2018-2029
        6.6.3 China Precision Wafer Dicing Blade Market Size, 2018-2029
        6.6.4 Japan Precision Wafer Dicing Blade Market Size, 2018-2029
        6.6.5 South Korea Precision Wafer Dicing Blade Market Size, 2018-2029
        6.6.6 Southeast Asia Precision Wafer Dicing Blade Market Size, 2018-2029
        6.6.7 India Precision Wafer Dicing Blade Market Size, 2018-2029
    6.7 South America
        6.7.1 By Country - South America Precision Wafer Dicing Blade Revenue, 2018-2029
        6.7.2 By Country - South America Precision Wafer Dicing Blade Sales, 2018-2029
        6.7.3 Brazil Precision Wafer Dicing Blade Market Size, 2018-2029
        6.7.4 Argentina Precision Wafer Dicing Blade Market Size, 2018-2029
    6.8 Middle East & Africa
        6.8.1 By Country - Middle East & Africa Precision Wafer Dicing Blade Revenue, 2018-2029
        6.8.2 By Country - Middle East & Africa Precision Wafer Dicing Blade Sales, 2018-2029
        6.8.3 Turkey Precision Wafer Dicing Blade Market Size, 2018-2029
        6.8.4 Israel Precision Wafer Dicing Blade Market Size, 2018-2029
        6.8.5 Saudi Arabia Precision Wafer Dicing Blade Market Size, 2018-2029
        6.8.6 UAE Precision Wafer Dicing Blade Market Size, 2018-2029
7 Manufacturers & Brands Profiles
    7.1 DISCO Corporation
        7.1.1 DISCO Corporation Company Summary
        7.1.2 DISCO Corporation Business Overview
        7.1.3 DISCO Corporation Precision Wafer Dicing Blade Major Product Offerings
        7.1.4 DISCO Corporation Precision Wafer Dicing Blade Sales and Revenue in Global (2018-2023)
        7.1.5 DISCO Corporation Key News & Latest Developments
    7.2 Thermocarbon Inc.
        7.2.1 Thermocarbon Inc. Company Summary
        7.2.2 Thermocarbon Inc. Business Overview
        7.2.3 Thermocarbon Inc. Precision Wafer Dicing Blade Major Product Offerings
        7.2.4 Thermocarbon Inc. Precision Wafer Dicing Blade Sales and Revenue in Global (2018-2023)
        7.2.5 Thermocarbon Inc. Key News & Latest Developments
    7.3 Kulicke and Soffa
        7.3.1 Kulicke and Soffa Company Summary
        7.3.2 Kulicke and Soffa Business Overview
        7.3.3 Kulicke and Soffa Precision Wafer Dicing Blade Major Product Offerings
        7.3.4 Kulicke and Soffa Precision Wafer Dicing Blade Sales and Revenue in Global (2018-2023)
        7.3.5 Kulicke and Soffa Key News & Latest Developments
    7.4 ADT
        7.4.1 ADT Company Summary
        7.4.2 ADT Business Overview
        7.4.3 ADT Precision Wafer Dicing Blade Major Product Offerings
        7.4.4 ADT Precision Wafer Dicing Blade Sales and Revenue in Global (2018-2023)
        7.4.5 ADT Key News & Latest Developments
    7.5 Shanghai Sinyang Semiconductor Materials
        7.5.1 Shanghai Sinyang Semiconductor Materials Company Summary
        7.5.2 Shanghai Sinyang Semiconductor Materials Business Overview
        7.5.3 Shanghai Sinyang Semiconductor Materials Precision Wafer Dicing Blade Major Product Offerings
        7.5.4 Shanghai Sinyang Semiconductor Materials Precision Wafer Dicing Blade Sales and Revenue in Global (2018-2023)
        7.5.5 Shanghai Sinyang Semiconductor Materials Key News & Latest Developments
    7.6 Shenzhen West Technology Co., Ltd.
        7.6.1 Shenzhen West Technology Co., Ltd. Company Summary
        7.6.2 Shenzhen West Technology Co., Ltd. Business Overview
        7.6.3 Shenzhen West Technology Co., Ltd. Precision Wafer Dicing Blade Major Product Offerings
        7.6.4 Shenzhen West Technology Co., Ltd. Precision Wafer Dicing Blade Sales and Revenue in Global (2018-2023)
        7.6.5 Shenzhen West Technology Co., Ltd. Key News & Latest Developments
    7.7 UKAM
        7.7.1 UKAM Company Summary
        7.7.2 UKAM Business Overview
        7.7.3 UKAM Precision Wafer Dicing Blade Major Product Offerings
        7.7.4 UKAM Precision Wafer Dicing Blade Sales and Revenue in Global (2018-2023)
        7.7.5 UKAM Key News & Latest Developments
    7.8 Ceiba
        7.8.1 Ceiba Company Summary
        7.8.2 Ceiba Business Overview
        7.8.3 Ceiba Precision Wafer Dicing Blade Major Product Offerings
        7.8.4 Ceiba Precision Wafer Dicing Blade Sales and Revenue in Global (2018-2023)
        7.8.5 Ceiba Key News & Latest Developments
    7.9 Shanghai Xiyue Machinery Technology Co., Ltd.
        7.9.1 Shanghai Xiyue Machinery Technology Co., Ltd. Company Summary
        7.9.2 Shanghai Xiyue Machinery Technology Co., Ltd. Business Overview
        7.9.3 Shanghai Xiyue Machinery Technology Co., Ltd. Precision Wafer Dicing Blade Major Product Offerings
        7.9.4 Shanghai Xiyue Machinery Technology Co., Ltd. Precision Wafer Dicing Blade Sales and Revenue in Global (2018-2023)
        7.9.5 Shanghai Xiyue Machinery Technology Co., Ltd. Key News & Latest Developments
    7.10 Zhengzhou Qisheng Precision Manufacturing Co., Ltd.
        7.10.1 Zhengzhou Qisheng Precision Manufacturing Co., Ltd. Company Summary
        7.10.2 Zhengzhou Qisheng Precision Manufacturing Co., Ltd. Business Overview
        7.10.3 Zhengzhou Qisheng Precision Manufacturing Co., Ltd. Precision Wafer Dicing Blade Major Product Offerings
        7.10.4 Zhengzhou Qisheng Precision Manufacturing Co., Ltd. Precision Wafer Dicing Blade Sales and Revenue in Global (2018-2023)
        7.10.5 Zhengzhou Qisheng Precision Manufacturing Co., Ltd. Key News & Latest Developments
8 Global Precision Wafer Dicing Blade Production Capacity, Analysis
    8.1 Global Precision Wafer Dicing Blade Production Capacity, 2018-2029
    8.2 Precision Wafer Dicing Blade Production Capacity of Key Manufacturers in Global Market
    8.3 Global Precision Wafer Dicing Blade Production by Region
9 Key Market Trends, Opportunity, Drivers and Restraints
    9.1 Market Opportunities & Trends
    9.2 Market Drivers
    9.3 Market Restraints
10 Precision Wafer Dicing Blade Supply Chain Analysis
    10.1 Precision Wafer Dicing Blade Industry Value Chain
    10.2 Precision Wafer Dicing Blade Upstream Market
    10.3 Precision Wafer Dicing Blade Downstream and Clients
    10.4 Marketing Channels Analysis
        10.4.1 Marketing Channels
        10.4.2 Precision Wafer Dicing Blade Distributors and Sales Agents in Global
11 Conclusion
12 Appendix
    12.1 Note
    12.2 Examples of Clients
    12.3 Disclaimer

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Precision Wafer Dicing Blade Market, Global Outlook and Forecast 2023-2029

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