Semiconductor Package Market, Global Outlook and Forecast 2023-2029

Report ID: MMG100241 | Category: Service & Software | Pages: 116 | Format: PDF | Published Date: July 12,2023

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Report Summary

Semiconductor packaging is conducted to guarantee protection to the wafer or substrate. The packaging is built from materials such as plastic, metal, glass or ceramic and is composed of one or more semiconductor electronic components.

Semiconductor packaging materials are base players of discrete semiconductor devices and integrated circuits on which other layers are deposited to complete the circuit. Thinner core materials are ideally used to surro system applications.

The validation of lead substrates has increased in comparison to lead frames and bonding wires as the industry advances more towards leadless and cable-less packages.

The market will experience robust growth due to increased demand for smart mobile devices and electronic goods.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Package, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Package. This report contains market size and forecasts of Semiconductor Package in global, including the following market information:
Global Semiconductor Package Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global top five companies in 2022 (%)
The global Semiconductor Package market was valued at US$ 29490 million in 2022 and is projected to reach US$ 42990 million by 2029, at a CAGR of 5.5% during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is to reach $ Million.
Flip Chip Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of Semiconductor Package include SPIL, ASE, Amkor, JCET, TFME, Siliconware Precision Industries, Powertech Technology Inc, TSMC and Nepes, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Semiconductor Package companies, and industry experts on this industry, involving the revenue, demand, product type, recent developments and plans, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Semiconductor Package Market, by Type, 2018-2023, 2024-2029 ($ millions)
Global Semiconductor Package Market Segment Percentages, by Type, 2022 (%)
    Flip Chip
    Embedded Die
    Fan-in Wafer Level Packaging (Fi Wlp)
    Fan-out Wafer Level Packaging
    Others
Global Semiconductor Package Market, by Application, 2018-2023, 2024-2029 ($ millions)
Global Semiconductor Package Market Segment Percentages, by Application, 2022 (%)
    Consumer Electronics
    Automotive Industry
    Aerospace and Defense
    Medical Devices
    Communications and Telecom
    Others
Global Semiconductor Package Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions)
Global Semiconductor Package Market Segment Percentages, By Region and Country, 2022 (%)
    North America
        US
        Canada
        Mexico
    Europe
        Germany
        France
        U.K.
        Italy
        Russia
        Nordic Countries
        Benelux
        Rest of Europe
    Asia
        China
        Japan
        South Korea
        Southeast Asia
        India
        Rest of Asia
    South America
        Brazil
        Argentina
        Rest of South America
    Middle East & Africa
        Turkey
        Israel
        Saudi Arabia
        UAE
        Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Semiconductor Package revenues in global market, 2018-2023 (estimated), ($ millions)
Key companies Semiconductor Package revenues share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
    SPIL
    ASE
    Amkor
    JCET
    TFME
    Siliconware Precision Industries
    Powertech Technology Inc
    TSMC
    Nepes
    Walton Advanced Engineering
    Unisem
    Huatian
    Chipbond
    UTAC
    Chipmos
    China Wafer Level CSP
    Lingsen Precision
    Tianshui Huatian Technology Co., Ltd
    King Yuan Electronics CO., Ltd.
    Formosa
    Carsem
    J-Devices
    Stats Chippac
    Advanced Micro Devices
Outline of Major Chapters:
Chapter 1: Introduces the definition of Semiconductor Package, market overview.
Chapter 2: Global Semiconductor Package market size in revenue.
Chapter 3: Detailed analysis of Semiconductor Package company competitive landscape, revenue and market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Semiconductor Package in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: The main points and conclusions of the report.

1 Introduction to Research & Analysis Reports
    1.1 Semiconductor Package Market Definition
    1.2 Market Segments
        1.2.1 Market by Type
        1.2.2 Market by Application
    1.3 Global Semiconductor Package Market Overview
    1.4 Features & Benefits of This Report
    1.5 Methodology & Sources of Information
        1.5.1 Research Methodology
        1.5.2 Research Process
        1.5.3 Base Year
        1.5.4 Report Assumptions & Caveats
2 Global Semiconductor Package Overall Market Size
    2.1 Global Semiconductor Package Market Size: 2022 VS 2029
    2.2 Global Semiconductor Package Market Size, Prospects & Forecasts: 2018-2029
    2.3 Key Market Trends, Opportunity, Drivers and Restraints
        2.3.1 Market Opportunities & Trends
        2.3.2 Market Drivers
        2.3.3 Market Restraints
3 Company Landscape
    3.1 Top Semiconductor Package Players in Global Market
    3.2 Top Global Semiconductor Package Companies Ranked by Revenue
    3.3 Global Semiconductor Package Revenue by Companies
    3.4 Top 3 and Top 5 Semiconductor Package Companies in Global Market, by Revenue in 2022
    3.5 Global Companies Semiconductor Package Product Type
    3.6 Tier 1, Tier 2 and Tier 3 Semiconductor Package Players in Global Market
        3.6.1 List of Global Tier 1 Semiconductor Package Companies
        3.6.2 List of Global Tier 2 and Tier 3 Semiconductor Package Companies
4 Market Sights by Product
    4.1 Overview
        4.1.1 By Type - Global Semiconductor Package Market Size Markets, 2022 & 2029
        4.1.2 Flip Chip
        4.1.3 Embedded Die
        4.1.4 Fan-in Wafer Level Packaging (Fi Wlp)
        4.1.5 Fan-out Wafer Level Packaging
        4.1.6 Others
    4.2 By Type - Global Semiconductor Package Revenue & Forecasts
        4.2.1 By Type - Global Semiconductor Package Revenue, 2018-2023
        4.2.2 By Type - Global Semiconductor Package Revenue, 2024-2029
        4.2.3 By Type - Global Semiconductor Package Revenue Market Share, 2018-2029
5 Sights by Application
    5.1 Overview
        5.1.1 By Application - Global Semiconductor Package Market Size, 2022 & 2029
        5.1.2 Consumer Electronics
        5.1.3 Automotive Industry
        5.1.4 Aerospace and Defense
        5.1.5 Medical Devices
        5.1.6 Communications and Telecom
        5.1.7 Others
    5.2 By Application - Global Semiconductor Package Revenue & Forecasts
        5.2.1 By Application - Global Semiconductor Package Revenue, 2018-2023
        5.2.2 By Application - Global Semiconductor Package Revenue, 2024-2029
        5.2.3 By Application - Global Semiconductor Package Revenue Market Share, 2018-2029
6 Sights by Region
    6.1 By Region - Global Semiconductor Package Market Size, 2022 & 2029
    6.2 By Region - Global Semiconductor Package Revenue & Forecasts
        6.2.1 By Region - Global Semiconductor Package Revenue, 2018-2023
        6.2.2 By Region - Global Semiconductor Package Revenue, 2024-2029
        6.2.3 By Region - Global Semiconductor Package Revenue Market Share, 2018-2029
    6.3 North America
        6.3.1 By Country - North America Semiconductor Package Revenue, 2018-2029
        6.3.2 US Semiconductor Package Market Size, 2018-2029
        6.3.3 Canada Semiconductor Package Market Size, 2018-2029
        6.3.4 Mexico Semiconductor Package Market Size, 2018-2029
    6.4 Europe
        6.4.1 By Country - Europe Semiconductor Package Revenue, 2018-2029
        6.4.2 Germany Semiconductor Package Market Size, 2018-2029
        6.4.3 France Semiconductor Package Market Size, 2018-2029
        6.4.4 U.K. Semiconductor Package Market Size, 2018-2029
        6.4.5 Italy Semiconductor Package Market Size, 2018-2029
        6.4.6 Russia Semiconductor Package Market Size, 2018-2029
        6.4.7 Nordic Countries Semiconductor Package Market Size, 2018-2029
        6.4.8 Benelux Semiconductor Package Market Size, 2018-2029
    6.5 Asia
        6.5.1 By Region - Asia Semiconductor Package Revenue, 2018-2029
        6.5.2 China Semiconductor Package Market Size, 2018-2029
        6.5.3 Japan Semiconductor Package Market Size, 2018-2029
        6.5.4 South Korea Semiconductor Package Market Size, 2018-2029
        6.5.5 Southeast Asia Semiconductor Package Market Size, 2018-2029
        6.5.6 India Semiconductor Package Market Size, 2018-2029
    6.6 South America
        6.6.1 By Country - South America Semiconductor Package Revenue, 2018-2029
        6.6.2 Brazil Semiconductor Package Market Size, 2018-2029
        6.6.3 Argentina Semiconductor Package Market Size, 2018-2029
    6.7 Middle East & Africa
        6.7.1 By Country - Middle East & Africa Semiconductor Package Revenue, 2018-2029
        6.7.2 Turkey Semiconductor Package Market Size, 2018-2029
        6.7.3 Israel Semiconductor Package Market Size, 2018-2029
        6.7.4 Saudi Arabia Semiconductor Package Market Size, 2018-2029
        6.7.5 UAE Semiconductor Package Market Size, 2018-2029
7 Semiconductor Package Companies Profiles
    7.1 SPIL
        7.1.1 SPIL Company Summary
        7.1.2 SPIL Business Overview
        7.1.3 SPIL Semiconductor Package Major Product Offerings
        7.1.4 SPIL Semiconductor Package Revenue in Global Market (2018-2023)
        7.1.5 SPIL Key News & Latest Developments
    7.2 ASE
        7.2.1 ASE Company Summary
        7.2.2 ASE Business Overview
        7.2.3 ASE Semiconductor Package Major Product Offerings
        7.2.4 ASE Semiconductor Package Revenue in Global Market (2018-2023)
        7.2.5 ASE Key News & Latest Developments
    7.3 Amkor
        7.3.1 Amkor Company Summary
        7.3.2 Amkor Business Overview
        7.3.3 Amkor Semiconductor Package Major Product Offerings
        7.3.4 Amkor Semiconductor Package Revenue in Global Market (2018-2023)
        7.3.5 Amkor Key News & Latest Developments
    7.4 JCET
        7.4.1 JCET Company Summary
        7.4.2 JCET Business Overview
        7.4.3 JCET Semiconductor Package Major Product Offerings
        7.4.4 JCET Semiconductor Package Revenue in Global Market (2018-2023)
        7.4.5 JCET Key News & Latest Developments
    7.5 TFME
        7.5.1 TFME Company Summary
        7.5.2 TFME Business Overview
        7.5.3 TFME Semiconductor Package Major Product Offerings
        7.5.4 TFME Semiconductor Package Revenue in Global Market (2018-2023)
        7.5.5 TFME Key News & Latest Developments
    7.6 Siliconware Precision Industries
        7.6.1 Siliconware Precision Industries Company Summary
        7.6.2 Siliconware Precision Industries Business Overview
        7.6.3 Siliconware Precision Industries Semiconductor Package Major Product Offerings
        7.6.4 Siliconware Precision Industries Semiconductor Package Revenue in Global Market (2018-2023)
        7.6.5 Siliconware Precision Industries Key News & Latest Developments
    7.7 Powertech Technology Inc
        7.7.1 Powertech Technology Inc Company Summary
        7.7.2 Powertech Technology Inc Business Overview
        7.7.3 Powertech Technology Inc Semiconductor Package Major Product Offerings
        7.7.4 Powertech Technology Inc Semiconductor Package Revenue in Global Market (2018-2023)
        7.7.5 Powertech Technology Inc Key News & Latest Developments
    7.8 TSMC
        7.8.1 TSMC Company Summary
        7.8.2 TSMC Business Overview
        7.8.3 TSMC Semiconductor Package Major Product Offerings
        7.8.4 TSMC Semiconductor Package Revenue in Global Market (2018-2023)
        7.8.5 TSMC Key News & Latest Developments
    7.9 Nepes
        7.9.1 Nepes Company Summary
        7.9.2 Nepes Business Overview
        7.9.3 Nepes Semiconductor Package Major Product Offerings
        7.9.4 Nepes Semiconductor Package Revenue in Global Market (2018-2023)
        7.9.5 Nepes Key News & Latest Developments
    7.10 Walton Advanced Engineering
        7.10.1 Walton Advanced Engineering Company Summary
        7.10.2 Walton Advanced Engineering Business Overview
        7.10.3 Walton Advanced Engineering Semiconductor Package Major Product Offerings
        7.10.4 Walton Advanced Engineering Semiconductor Package Revenue in Global Market (2018-2023)
        7.10.5 Walton Advanced Engineering Key News & Latest Developments
    7.11 Unisem
        7.11.1 Unisem Company Summary
        7.11.2 Unisem Business Overview
        7.11.3 Unisem Semiconductor Package Major Product Offerings
        7.11.4 Unisem Semiconductor Package Revenue in Global Market (2018-2023)
        7.11.5 Unisem Key News & Latest Developments
    7.12 Huatian
        7.12.1 Huatian Company Summary
        7.12.2 Huatian Business Overview
        7.12.3 Huatian Semiconductor Package Major Product Offerings
        7.12.4 Huatian Semiconductor Package Revenue in Global Market (2018-2023)
        7.12.5 Huatian Key News & Latest Developments
    7.13 Chipbond
        7.13.1 Chipbond Company Summary
        7.13.2 Chipbond Business Overview
        7.13.3 Chipbond Semiconductor Package Major Product Offerings
        7.13.4 Chipbond Semiconductor Package Revenue in Global Market (2018-2023)
        7.13.5 Chipbond Key News & Latest Developments
    7.14 UTAC
        7.14.1 UTAC Company Summary
        7.14.2 UTAC Business Overview
        7.14.3 UTAC Semiconductor Package Major Product Offerings
        7.14.4 UTAC Semiconductor Package Revenue in Global Market (2018-2023)
        7.14.5 UTAC Key News & Latest Developments
    7.15 Chipmos
        7.15.1 Chipmos Company Summary
        7.15.2 Chipmos Business Overview
        7.15.3 Chipmos Semiconductor Package Major Product Offerings
        7.15.4 Chipmos Semiconductor Package Revenue in Global Market (2018-2023)
        7.15.5 Chipmos Key News & Latest Developments
    7.16 China Wafer Level CSP
        7.16.1 China Wafer Level CSP Company Summary
        7.16.2 China Wafer Level CSP Business Overview
        7.16.3 China Wafer Level CSP Semiconductor Package Major Product Offerings
        7.16.4 China Wafer Level CSP Semiconductor Package Revenue in Global Market (2018-2023)
        7.16.5 China Wafer Level CSP Key News & Latest Developments
    7.17 Lingsen Precision
        7.17.1 Lingsen Precision Company Summary
        7.17.2 Lingsen Precision Business Overview
        7.17.3 Lingsen Precision Semiconductor Package Major Product Offerings
        7.17.4 Lingsen Precision Semiconductor Package Revenue in Global Market (2018-2023)
        7.17.5 Lingsen Precision Key News & Latest Developments
    7.18 Tianshui Huatian Technology Co., Ltd
        7.18.1 Tianshui Huatian Technology Co., Ltd Company Summary
        7.18.2 Tianshui Huatian Technology Co., Ltd Business Overview
        7.18.3 Tianshui Huatian Technology Co., Ltd Semiconductor Package Major Product Offerings
        7.18.4 Tianshui Huatian Technology Co., Ltd Semiconductor Package Revenue in Global Market (2018-2023)
        7.18.5 Tianshui Huatian Technology Co., Ltd Key News & Latest Developments
    7.19 King Yuan Electronics CO., Ltd.
        7.19.1 King Yuan Electronics CO., Ltd. Company Summary
        7.19.2 King Yuan Electronics CO., Ltd. Business Overview
        7.19.3 King Yuan Electronics CO., Ltd. Semiconductor Package Major Product Offerings
        7.19.4 King Yuan Electronics CO., Ltd. Semiconductor Package Revenue in Global Market (2018-2023)
        7.19.5 King Yuan Electronics CO., Ltd. Key News & Latest Developments
    7.20 Formosa
        7.20.1 Formosa Company Summary
        7.20.2 Formosa Business Overview
        7.20.3 Formosa Semiconductor Package Major Product Offerings
        7.20.4 Formosa Semiconductor Package Revenue in Global Market (2018-2023)
        7.20.5 Formosa Key News & Latest Developments
    7.21 Carsem
        7.21.1 Carsem Company Summary
        7.21.2 Carsem Business Overview
        7.21.3 Carsem Semiconductor Package Major Product Offerings
        7.21.4 Carsem Semiconductor Package Revenue in Global Market (2018-2023)
        7.21.5 Carsem Key News & Latest Developments
    7.22 J-Devices
        7.22.1 J-Devices Company Summary
        7.22.2 J-Devices Business Overview
        7.22.3 J-Devices Semiconductor Package Major Product Offerings
        7.22.4 J-Devices Semiconductor Package Revenue in Global Market (2018-2023)
        7.22.5 J-Devices Key News & Latest Developments
    7.23 Stats Chippac
        7.23.1 Stats Chippac Company Summary
        7.23.2 Stats Chippac Business Overview
        7.23.3 Stats Chippac Semiconductor Package Major Product Offerings
        7.23.4 Stats Chippac Semiconductor Package Revenue in Global Market (2018-2023)
        7.23.5 Stats Chippac Key News & Latest Developments
    7.24 Advanced Micro Devices
        7.24.1 Advanced Micro Devices Company Summary
        7.24.2 Advanced Micro Devices Business Overview
        7.24.3 Advanced Micro Devices Semiconductor Package Major Product Offerings
        7.24.4 Advanced Micro Devices Semiconductor Package Revenue in Global Market (2018-2023)
        7.24.5 Advanced Micro Devices Key News & Latest Developments
8 Conclusion
9 Appendix
    9.1 Note
    9.2 Examples of Clients
    9.3 Disclaimer

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Semiconductor Package Market, Global Outlook and Forecast 2023-2029

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