Small Outline Integrated Circuit (SOIC) Package Market, Global Outlook and Forecast 2023-2029

Report ID: MMG146149 | Category: Electronics & Semiconductor | Pages: 115 | Format: PDF | Published Date: July 21,2023

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Report Description
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Report Summary

A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. They are generally available in the same pin-outs as their counterpart DIP ICs. The convention for naming the package is SOIC or SO followed by the number of pins.
This report aims to provide a comprehensive presentation of the global market for Small Outline Integrated Circuit (SOIC) Package, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Small Outline Integrated Circuit (SOIC) Package. This report contains market size and forecasts of Small Outline Integrated Circuit (SOIC) Package in global, including the following market information:
Global Small Outline Integrated Circuit (SOIC) Package Market Revenue, 2018-2023, 2024-2029, ($ millions)
Global Small Outline Integrated Circuit (SOIC) Package Market Sales, 2018-2023, 2024-2029, (K Units)
Global top five Small Outline Integrated Circuit (SOIC) Package companies in 2022 (%)
The global Small Outline Integrated Circuit (SOIC) Package market was valued at US$ million in 2022 and is projected to reach US$ million by 2029, at a CAGR of % during the forecast period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
The U.S. Market is Estimated at $ Million in 2022, While China is Forecast to Reach $ Million.
Mini-SOIC Segment to Reach $ Million by 2029, with a % CAGR in next six years.
The global key manufacturers of Small Outline Integrated Circuit (SOIC) Package include 3M, Enplas Corporation, Toshiba Electronic Devices and Storage Corporation, Intel Corporation, Loranger International Corporation, Komachine, Aries Electronics Inc, Johnstech International and Mill-Max Manufacturing Corporation, etc. in 2022, the global top five players have a share approximately % in terms of revenue.
MARKET MONITOR GLOBAL, INC (MMG) has surveyed the Small Outline Integrated Circuit (SOIC) Package manufacturers, suppliers, distributors and industry experts on this industry, involving the sales, revenue, demand, price change, product type, recent development and plan, industry trends, drivers, challenges, obstacles, and potential risks.
Total Market by Segment:
Global Small Outline Integrated Circuit (SOIC) Package Market, by Type, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Small Outline Integrated Circuit (SOIC) Package Market Segment Percentages, by Type, 2022 (%)
    Mini-SOIC
    Small Outline J-Lead Package
    Others
Global Small Outline Integrated Circuit (SOIC) Package Market, by Application, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Small Outline Integrated Circuit (SOIC) Package Market Segment Percentages, by Application, 2022 (%)
    Industrial
    Consumer Electronics
    Automotive
    Medical Devices
    Military and Defense
Global Small Outline Integrated Circuit (SOIC) Package Market, By Region and Country, 2018-2023, 2024-2029 ($ Millions) & (K Units)
Global Small Outline Integrated Circuit (SOIC) Package Market Segment Percentages, By Region and Country, 2022 (%)
    North America
        US
        Canada
        Mexico
    Europe
        Germany
        France
        U.K.
        Italy
        Russia
        Nordic Countries
        Benelux
        Rest of Europe
    Asia
        China
        Japan
        South Korea
        Southeast Asia
        India
        Rest of Asia
    South America
        Brazil
        Argentina
        Rest of South America
    Middle East & Africa
        Turkey
        Israel
        Saudi Arabia
        UAE
        Rest of Middle East & Africa
Competitor Analysis
The report also provides analysis of leading market participants including:
Key companies Small Outline Integrated Circuit (SOIC) Package revenues in global market, 2018-2023 (Estimated), ($ millions)
Key companies Small Outline Integrated Circuit (SOIC) Package revenues share in global market, 2022 (%)
Key companies Small Outline Integrated Circuit (SOIC) Package sales in global market, 2018-2023 (Estimated), (K Units)
Key companies Small Outline Integrated Circuit (SOIC) Package sales share in global market, 2022 (%)
Further, the report presents profiles of competitors in the market, key players include:
    3M
    Enplas Corporation
    Toshiba Electronic Devices and Storage Corporation
    Intel Corporation
    Loranger International Corporation
    Komachine
    Aries Electronics Inc
    Johnstech International
    Mill-Max Manufacturing Corporation
    Molex
    Foxconn
    Sensata Technologies
    Plastronics
    TE Connectivity
    Socionext America Inc
    WinWay Technology Co
    ChipMOS Technologies Inc
    Yamaichi Electronics
Outline of Major Chapters:
Chapter 1: Introduces the definition of Small Outline Integrated Circuit (SOIC) Package, market overview.
Chapter 2: Global Small Outline Integrated Circuit (SOIC) Package market size in revenue and volume.
Chapter 3: Detailed analysis of Small Outline Integrated Circuit (SOIC) Package manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6: Sales of Small Outline Integrated Circuit (SOIC) Package in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Global Small Outline Integrated Circuit (SOIC) Package capacity by region & country.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 11: The main points and conclusions of the report.

1 Introduction to Research & Analysis Reports
    1.1 Small Outline Integrated Circuit (SOIC) Package Market Definition
    1.2 Market Segments
        1.2.1 Market by Type
        1.2.2 Market by Application
    1.3 Global Small Outline Integrated Circuit (SOIC) Package Market Overview
    1.4 Features & Benefits of This Report
    1.5 Methodology & Sources of Information
        1.5.1 Research Methodology
        1.5.2 Research Process
        1.5.3 Base Year
        1.5.4 Report Assumptions & Caveats
2 Global Small Outline Integrated Circuit (SOIC) Package Overall Market Size
    2.1 Global Small Outline Integrated Circuit (SOIC) Package Market Size: 2022 VS 2029
    2.2 Global Small Outline Integrated Circuit (SOIC) Package Revenue, Prospects & Forecasts: 2018-2029
    2.3 Global Small Outline Integrated Circuit (SOIC) Package Sales: 2018-2029
3 Company Landscape
    3.1 Top Small Outline Integrated Circuit (SOIC) Package Players in Global Market
    3.2 Top Global Small Outline Integrated Circuit (SOIC) Package Companies Ranked by Revenue
    3.3 Global Small Outline Integrated Circuit (SOIC) Package Revenue by Companies
    3.4 Global Small Outline Integrated Circuit (SOIC) Package Sales by Companies
    3.5 Global Small Outline Integrated Circuit (SOIC) Package Price by Manufacturer (2018-2023)
    3.6 Top 3 and Top 5 Small Outline Integrated Circuit (SOIC) Package Companies in Global Market, by Revenue in 2022
    3.7 Global Manufacturers Small Outline Integrated Circuit (SOIC) Package Product Type
    3.8 Tier 1, Tier 2 and Tier 3 Small Outline Integrated Circuit (SOIC) Package Players in Global Market
        3.8.1 List of Global Tier 1 Small Outline Integrated Circuit (SOIC) Package Companies
        3.8.2 List of Global Tier 2 and Tier 3 Small Outline Integrated Circuit (SOIC) Package Companies
4 Sights by Product
    4.1 Overview
        4.1.1 By Type - Global Small Outline Integrated Circuit (SOIC) Package Market Size Markets, 2022 & 2029
        4.1.2 Mini-SOIC
        4.1.3 Small Outline J-Lead Package
        4.1.4 Others
    4.2 By Type - Global Small Outline Integrated Circuit (SOIC) Package Revenue & Forecasts
        4.2.1 By Type - Global Small Outline Integrated Circuit (SOIC) Package Revenue, 2018-2023
        4.2.2 By Type - Global Small Outline Integrated Circuit (SOIC) Package Revenue, 2024-2029
        4.2.3 By Type - Global Small Outline Integrated Circuit (SOIC) Package Revenue Market Share, 2018-2029
    4.3 By Type - Global Small Outline Integrated Circuit (SOIC) Package Sales & Forecasts
        4.3.1 By Type - Global Small Outline Integrated Circuit (SOIC) Package Sales, 2018-2023
        4.3.2 By Type - Global Small Outline Integrated Circuit (SOIC) Package Sales, 2024-2029
        4.3.3 By Type - Global Small Outline Integrated Circuit (SOIC) Package Sales Market Share, 2018-2029
    4.4 By Type - Global Small Outline Integrated Circuit (SOIC) Package Price (Manufacturers Selling Prices), 2018-2029
5 Sights by Application
    5.1 Overview
        5.1.1 By Application - Global Small Outline Integrated Circuit (SOIC) Package Market Size, 2022 & 2029
        5.1.2 Industrial
        5.1.3 Consumer Electronics
        5.1.4 Automotive
        5.1.5 Medical Devices
        5.1.6 Military and Defense
    5.2 By Application - Global Small Outline Integrated Circuit (SOIC) Package Revenue & Forecasts
        5.2.1 By Application - Global Small Outline Integrated Circuit (SOIC) Package Revenue, 2018-2023
        5.2.2 By Application - Global Small Outline Integrated Circuit (SOIC) Package Revenue, 2024-2029
        5.2.3 By Application - Global Small Outline Integrated Circuit (SOIC) Package Revenue Market Share, 2018-2029
    5.3 By Application - Global Small Outline Integrated Circuit (SOIC) Package Sales & Forecasts
        5.3.1 By Application - Global Small Outline Integrated Circuit (SOIC) Package Sales, 2018-2023
        5.3.2 By Application - Global Small Outline Integrated Circuit (SOIC) Package Sales, 2024-2029
        5.3.3 By Application - Global Small Outline Integrated Circuit (SOIC) Package Sales Market Share, 2018-2029
    5.4 By Application - Global Small Outline Integrated Circuit (SOIC) Package Price (Manufacturers Selling Prices), 2018-2029
6 Sights by Region
    6.1 By Region - Global Small Outline Integrated Circuit (SOIC) Package Market Size, 2022 & 2029
    6.2 By Region - Global Small Outline Integrated Circuit (SOIC) Package Revenue & Forecasts
        6.2.1 By Region - Global Small Outline Integrated Circuit (SOIC) Package Revenue, 2018-2023
        6.2.2 By Region - Global Small Outline Integrated Circuit (SOIC) Package Revenue, 2024-2029
        6.2.3 By Region - Global Small Outline Integrated Circuit (SOIC) Package Revenue Market Share, 2018-2029
    6.3 By Region - Global Small Outline Integrated Circuit (SOIC) Package Sales & Forecasts
        6.3.1 By Region - Global Small Outline Integrated Circuit (SOIC) Package Sales, 2018-2023
        6.3.2 By Region - Global Small Outline Integrated Circuit (SOIC) Package Sales, 2024-2029
        6.3.3 By Region - Global Small Outline Integrated Circuit (SOIC) Package Sales Market Share, 2018-2029
    6.4 North America
        6.4.1 By Country - North America Small Outline Integrated Circuit (SOIC) Package Revenue, 2018-2029
        6.4.2 By Country - North America Small Outline Integrated Circuit (SOIC) Package Sales, 2018-2029
        6.4.3 US Small Outline Integrated Circuit (SOIC) Package Market Size, 2018-2029
        6.4.4 Canada Small Outline Integrated Circuit (SOIC) Package Market Size, 2018-2029
        6.4.5 Mexico Small Outline Integrated Circuit (SOIC) Package Market Size, 2018-2029
    6.5 Europe
        6.5.1 By Country - Europe Small Outline Integrated Circuit (SOIC) Package Revenue, 2018-2029
        6.5.2 By Country - Europe Small Outline Integrated Circuit (SOIC) Package Sales, 2018-2029
        6.5.3 Germany Small Outline Integrated Circuit (SOIC) Package Market Size, 2018-2029
        6.5.4 France Small Outline Integrated Circuit (SOIC) Package Market Size, 2018-2029
        6.5.5 U.K. Small Outline Integrated Circuit (SOIC) Package Market Size, 2018-2029
        6.5.6 Italy Small Outline Integrated Circuit (SOIC) Package Market Size, 2018-2029
        6.5.7 Russia Small Outline Integrated Circuit (SOIC) Package Market Size, 2018-2029
        6.5.8 Nordic Countries Small Outline Integrated Circuit (SOIC) Package Market Size, 2018-2029
        6.5.9 Benelux Small Outline Integrated Circuit (SOIC) Package Market Size, 2018-2029
    6.6 Asia
        6.6.1 By Region - Asia Small Outline Integrated Circuit (SOIC) Package Revenue, 2018-2029
        6.6.2 By Region - Asia Small Outline Integrated Circuit (SOIC) Package Sales, 2018-2029
        6.6.3 China Small Outline Integrated Circuit (SOIC) Package Market Size, 2018-2029
        6.6.4 Japan Small Outline Integrated Circuit (SOIC) Package Market Size, 2018-2029
        6.6.5 South Korea Small Outline Integrated Circuit (SOIC) Package Market Size, 2018-2029
        6.6.6 Southeast Asia Small Outline Integrated Circuit (SOIC) Package Market Size, 2018-2029
        6.6.7 India Small Outline Integrated Circuit (SOIC) Package Market Size, 2018-2029
    6.7 South America
        6.7.1 By Country - South America Small Outline Integrated Circuit (SOIC) Package Revenue, 2018-2029
        6.7.2 By Country - South America Small Outline Integrated Circuit (SOIC) Package Sales, 2018-2029
        6.7.3 Brazil Small Outline Integrated Circuit (SOIC) Package Market Size, 2018-2029
        6.7.4 Argentina Small Outline Integrated Circuit (SOIC) Package Market Size, 2018-2029
    6.8 Middle East & Africa
        6.8.1 By Country - Middle East & Africa Small Outline Integrated Circuit (SOIC) Package Revenue, 2018-2029
        6.8.2 By Country - Middle East & Africa Small Outline Integrated Circuit (SOIC) Package Sales, 2018-2029
        6.8.3 Turkey Small Outline Integrated Circuit (SOIC) Package Market Size, 2018-2029
        6.8.4 Israel Small Outline Integrated Circuit (SOIC) Package Market Size, 2018-2029
        6.8.5 Saudi Arabia Small Outline Integrated Circuit (SOIC) Package Market Size, 2018-2029
        6.8.6 UAE Small Outline Integrated Circuit (SOIC) Package Market Size, 2018-2029
7 Manufacturers & Brands Profiles
    7.1 3M
        7.1.1 3M Company Summary
        7.1.2 3M Business Overview
        7.1.3 3M Small Outline Integrated Circuit (SOIC) Package Major Product Offerings
        7.1.4 3M Small Outline Integrated Circuit (SOIC) Package Sales and Revenue in Global (2018-2023)
        7.1.5 3M Key News & Latest Developments
    7.2 Enplas Corporation
        7.2.1 Enplas Corporation Company Summary
        7.2.2 Enplas Corporation Business Overview
        7.2.3 Enplas Corporation Small Outline Integrated Circuit (SOIC) Package Major Product Offerings
        7.2.4 Enplas Corporation Small Outline Integrated Circuit (SOIC) Package Sales and Revenue in Global (2018-2023)
        7.2.5 Enplas Corporation Key News & Latest Developments
    7.3 Toshiba Electronic Devices and Storage Corporation
        7.3.1 Toshiba Electronic Devices and Storage Corporation Company Summary
        7.3.2 Toshiba Electronic Devices and Storage Corporation Business Overview
        7.3.3 Toshiba Electronic Devices and Storage Corporation Small Outline Integrated Circuit (SOIC) Package Major Product Offerings
        7.3.4 Toshiba Electronic Devices and Storage Corporation Small Outline Integrated Circuit (SOIC) Package Sales and Revenue in Global (2018-2023)
        7.3.5 Toshiba Electronic Devices and Storage Corporation Key News & Latest Developments
    7.4 Intel Corporation
        7.4.1 Intel Corporation Company Summary
        7.4.2 Intel Corporation Business Overview
        7.4.3 Intel Corporation Small Outline Integrated Circuit (SOIC) Package Major Product Offerings
        7.4.4 Intel Corporation Small Outline Integrated Circuit (SOIC) Package Sales and Revenue in Global (2018-2023)
        7.4.5 Intel Corporation Key News & Latest Developments
    7.5 Loranger International Corporation
        7.5.1 Loranger International Corporation Company Summary
        7.5.2 Loranger International Corporation Business Overview
        7.5.3 Loranger International Corporation Small Outline Integrated Circuit (SOIC) Package Major Product Offerings
        7.5.4 Loranger International Corporation Small Outline Integrated Circuit (SOIC) Package Sales and Revenue in Global (2018-2023)
        7.5.5 Loranger International Corporation Key News & Latest Developments
    7.6 Komachine
        7.6.1 Komachine Company Summary
        7.6.2 Komachine Business Overview
        7.6.3 Komachine Small Outline Integrated Circuit (SOIC) Package Major Product Offerings
        7.6.4 Komachine Small Outline Integrated Circuit (SOIC) Package Sales and Revenue in Global (2018-2023)
        7.6.5 Komachine Key News & Latest Developments
    7.7 Aries Electronics Inc
        7.7.1 Aries Electronics Inc Company Summary
        7.7.2 Aries Electronics Inc Business Overview
        7.7.3 Aries Electronics Inc Small Outline Integrated Circuit (SOIC) Package Major Product Offerings
        7.7.4 Aries Electronics Inc Small Outline Integrated Circuit (SOIC) Package Sales and Revenue in Global (2018-2023)
        7.7.5 Aries Electronics Inc Key News & Latest Developments
    7.8 Johnstech International
        7.8.1 Johnstech International Company Summary
        7.8.2 Johnstech International Business Overview
        7.8.3 Johnstech International Small Outline Integrated Circuit (SOIC) Package Major Product Offerings
        7.8.4 Johnstech International Small Outline Integrated Circuit (SOIC) Package Sales and Revenue in Global (2018-2023)
        7.8.5 Johnstech International Key News & Latest Developments
    7.9 Mill-Max Manufacturing Corporation
        7.9.1 Mill-Max Manufacturing Corporation Company Summary
        7.9.2 Mill-Max Manufacturing Corporation Business Overview
        7.9.3 Mill-Max Manufacturing Corporation Small Outline Integrated Circuit (SOIC) Package Major Product Offerings
        7.9.4 Mill-Max Manufacturing Corporation Small Outline Integrated Circuit (SOIC) Package Sales and Revenue in Global (2018-2023)
        7.9.5 Mill-Max Manufacturing Corporation Key News & Latest Developments
    7.10 Molex
        7.10.1 Molex Company Summary
        7.10.2 Molex Business Overview
        7.10.3 Molex Small Outline Integrated Circuit (SOIC) Package Major Product Offerings
        7.10.4 Molex Small Outline Integrated Circuit (SOIC) Package Sales and Revenue in Global (2018-2023)
        7.10.5 Molex Key News & Latest Developments
    7.11 Foxconn
        7.11.1 Foxconn Company Summary
        7.11.2 Foxconn Small Outline Integrated Circuit (SOIC) Package Business Overview
        7.11.3 Foxconn Small Outline Integrated Circuit (SOIC) Package Major Product Offerings
        7.11.4 Foxconn Small Outline Integrated Circuit (SOIC) Package Sales and Revenue in Global (2018-2023)
        7.11.5 Foxconn Key News & Latest Developments
    7.12 Sensata Technologies
        7.12.1 Sensata Technologies Company Summary
        7.12.2 Sensata Technologies Small Outline Integrated Circuit (SOIC) Package Business Overview
        7.12.3 Sensata Technologies Small Outline Integrated Circuit (SOIC) Package Major Product Offerings
        7.12.4 Sensata Technologies Small Outline Integrated Circuit (SOIC) Package Sales and Revenue in Global (2018-2023)
        7.12.5 Sensata Technologies Key News & Latest Developments
    7.13 Plastronics
        7.13.1 Plastronics Company Summary
        7.13.2 Plastronics Small Outline Integrated Circuit (SOIC) Package Business Overview
        7.13.3 Plastronics Small Outline Integrated Circuit (SOIC) Package Major Product Offerings
        7.13.4 Plastronics Small Outline Integrated Circuit (SOIC) Package Sales and Revenue in Global (2018-2023)
        7.13.5 Plastronics Key News & Latest Developments
    7.14 TE Connectivity
        7.14.1 TE Connectivity Company Summary
        7.14.2 TE Connectivity Business Overview
        7.14.3 TE Connectivity Small Outline Integrated Circuit (SOIC) Package Major Product Offerings
        7.14.4 TE Connectivity Small Outline Integrated Circuit (SOIC) Package Sales and Revenue in Global (2018-2023)
        7.14.5 TE Connectivity Key News & Latest Developments
    7.15 Socionext America Inc
        7.15.1 Socionext America Inc Company Summary
        7.15.2 Socionext America Inc Business Overview
        7.15.3 Socionext America Inc Small Outline Integrated Circuit (SOIC) Package Major Product Offerings
        7.15.4 Socionext America Inc Small Outline Integrated Circuit (SOIC) Package Sales and Revenue in Global (2018-2023)
        7.15.5 Socionext America Inc Key News & Latest Developments
    7.16 WinWay Technology Co
        7.16.1 WinWay Technology Co Company Summary
        7.16.2 WinWay Technology Co Business Overview
        7.16.3 WinWay Technology Co Small Outline Integrated Circuit (SOIC) Package Major Product Offerings
        7.16.4 WinWay Technology Co Small Outline Integrated Circuit (SOIC) Package Sales and Revenue in Global (2018-2023)
        7.16.5 WinWay Technology Co Key News & Latest Developments
    7.17 ChipMOS Technologies Inc
        7.17.1 ChipMOS Technologies Inc Company Summary
        7.17.2 ChipMOS Technologies Inc Business Overview
        7.17.3 ChipMOS Technologies Inc Small Outline Integrated Circuit (SOIC) Package Major Product Offerings
        7.17.4 ChipMOS Technologies Inc Small Outline Integrated Circuit (SOIC) Package Sales and Revenue in Global (2018-2023)
        7.17.5 ChipMOS Technologies Inc Key News & Latest Developments
    7.18 Yamaichi Electronics
        7.18.1 Yamaichi Electronics Company Summary
        7.18.2 Yamaichi Electronics Business Overview
        7.18.3 Yamaichi Electronics Small Outline Integrated Circuit (SOIC) Package Major Product Offerings
        7.18.4 Yamaichi Electronics Small Outline Integrated Circuit (SOIC) Package Sales and Revenue in Global (2018-2023)
        7.18.5 Yamaichi Electronics Key News & Latest Developments
8 Global Small Outline Integrated Circuit (SOIC) Package Production Capacity, Analysis
    8.1 Global Small Outline Integrated Circuit (SOIC) Package Production Capacity, 2018-2029
    8.2 Small Outline Integrated Circuit (SOIC) Package Production Capacity of Key Manufacturers in Global Market
    8.3 Global Small Outline Integrated Circuit (SOIC) Package Production by Region
9 Key Market Trends, Opportunity, Drivers and Restraints
    9.1 Market Opportunities & Trends
    9.2 Market Drivers
    9.3 Market Restraints
10 Small Outline Integrated Circuit (SOIC) Package Supply Chain Analysis
    10.1 Small Outline Integrated Circuit (SOIC) Package Industry Value Chain
    10.2 Small Outline Integrated Circuit (SOIC) Package Upstream Market
    10.3 Small Outline Integrated Circuit (SOIC) Package Downstream and Clients
    10.4 Marketing Channels Analysis
        10.4.1 Marketing Channels
        10.4.2 Small Outline Integrated Circuit (SOIC) Package Distributors and Sales Agents in Global
11 Conclusion
12 Appendix
    12.1 Note
    12.2 Examples of Clients
    12.3 Disclaimer

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Small Outline Integrated Circuit (SOIC) Package Market, Global Outlook and Forecast 2023-2029

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